- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/633 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only
Patent holdings for IPC class H01R 13/633
Total number of patents in this class: 566
10-year publication summary
59
|
60
|
50
|
74
|
52
|
44
|
54
|
35
|
40
|
12
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
TE Connectivity Solutions GmbH | 2580 |
15 |
3m Innovative Properties Company | 18406 |
13 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
12 |
Foxconn Interconnect Technology Limited | 1034 |
11 |
Yazaki Corporation | 6282 |
10 |
Aptiv Technologies AG | 2097 |
10 |
Sumitomo Wiring Systems, Ltd. | 9367 |
9 |
Japan Aviation Electronics Industry, Limited | 1585 |
8 |
Molex Incorporated | 609 |
7 |
Molex, LLC | 1792 |
7 |
Neutrik AG | 197 |
7 |
Scolmore (International) Limited | 42 |
7 |
Senko Advanced Components, Inc. | 454 |
7 |
Dongguan Luxshare Technologies Co., Ltd. | 191 |
7 |
Dell Products L.P. | 11144 |
6 |
Tyco Electronics Corporation | 792 |
6 |
CommScope Connectivity Belgium BVBA | 497 |
6 |
WAGO Verwaltungsgesellschaft mbH | 462 |
6 |
TE Connectivity Corporation | 462 |
6 |
Intel Corporation | 45621 |
5 |
Other owners | 401 |